8 amplifiers - smt 8 - 28 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201 general description features functional diagram smt mmwave package gain > 15 db broadband performance saturated output power: +24 dbm positive supply: +5v to +7v electrical specifications, t a = +25 c, vdd = +6v typical applications the hmc300lm1 is a broadband surface mount medium power ampli er that operates between 25.5 and 33.5 ghz. a 0.25 um power phemt process is used to achieve ef cient gain and output power performance. high volume surface mount re- ow assembly techniques may be used to mount the ampli er to the end users pcb. the lm1 package eliminates the need for wire bonding or die attach mounting. the ampli er provides 15 db of gain and +24 dbm of saturated output power across various microwave radio bands. this millimeter wave ampli er requires no external rf matching components and minimal dc bypass components. the ampli er operates from a +6v vdd and a - 0.35v vgg gate bias. *adjust vgg 1 between -1.0 to 0v to achieve idd = 220 ma typical. this ampli er is ideal for use as a power ampli er for 25.5 - 33.5 ghz applications: ? lmds ? microwave radio parameter min. typ. max. units frequency range 25.5 - 33.5 ghz gain 13 16 22 db gain variation over temperature 0.06 0.07 db/c input return loss 5 8 db output return loss 5 8 db reverse isolation 35 50 db output 1 db compression (p1db) 20 23 dbm saturated output power (psat) 21 24 dbm output third order intercept (ip3) (two-tone input power = -5 dbm each tone) 21 26 dbm supply current (idd)(vdd = +6.0 vdc)* 220 275 ma
8 amplifiers - smt 8 - 29 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com gain vs. temperature @ vdd = +6v output return loss vs. temperature @ vdd = +6v input return loss vs. temperature @ vdd = +6v output ip3 vs. temperature @ vdd = +6v broadband gain & return loss p1db output power vs. temperature @ vdd = +6v -25 -20 -15 -10 -5 0 5 10 15 20 25 20 25 30 35 40 s21 s11 s22 response (db) frequency (ghz) -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 33 34 35 +25 c -40 c +85 c return loss (db) frequency (ghz) -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 33 34 35 +25 c +85 c -40 c return loss (db) frequency (ghz) 0 5 10 15 20 25 30 35 24 25 26 27 28 29 30 31 32 33 34 35 +25 c +85 c -40 c third order intercept point (dbm) frequency (ghz) 0 5 10 15 20 25 30 24 25 26 27 28 29 30 31 32 33 34 35 +25 c +85 c -40 c output p1db (dbm) frequency (ghz) 0 5 10 15 20 25 24 25 26 27 28 29 30 31 32 33 34 35 +25 c +85 c -40 c gain (db) frequency (ghz) hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 30 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com psat output power vs. vdd ip3 vs. vdd input return loss vs. vdd gain vs. vdd output return loss vs. vdd p1db output power vs. vdd 0 5 10 15 20 25 30 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v output p1db (dbm) frequency (ghz) -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v return loss (db) frequency (ghz) 0 5 10 15 20 25 30 35 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v third order intercept point (dbm) frequency (ghz) 0 5 10 15 20 25 30 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v psat (dbm) frequency (ghz) -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v return loss (db) frequency (ghz) 0 5 10 15 20 25 24 25 26 27 28 29 30 31 32 33 34 35 vdd=+5v vdd=+6v vdd=+7v gain (db) frequency (ghz) hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 31 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com outline drawing absolute maximum ratings notes: 1. material: plastic 2. plating: gold over nickel 3. dimensions are in inches [millimeters]. 4. all tolerances are 0.005 [ 0.13]. 5. all grounds must be soldered to pcb rf ground. 6. ? indicates pin 1 drain bias voltage (vdd1, vdd2) +5.0 vdc drain bias current (idd) 500 ma gate bias voltage (vgg1) -2.0 to +0.4 vdc rf input power (rfin)(vdd = +6.0 vdc) +17 dbm channel temperature 150 c continuous pdiss (t = 85 c) (derate 15.03 mw/c above 85 c) 0.977 w thermal resistance (channel to ground paddle) 67 c/w storage temperature -65 to +150 c operating temperature -40 to +85c pin function 1gnd 2vdd1 3vdd2 4 rf out 5gnd 6vgg1 7gnd 8rf in % , % # 4 2 / 3 4 ! 4 ) # 3 % . 3 ) 4 ) 6 % $ % 6 ) # % / " 3 % 2 6 % ( ! . $ , ) . ' 0 2 % # ! 5 4 ) / . 3 hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 32 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com evaluation pcb the grounded co-planar wave guide (cpwg) pcb input/output transitions allow use of ground-signal-ground (gsg) probes for testing. suggested probe pitch is 400m (16 mils). alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. evaluation circuit board layout design details lm1 package mounted to evaluation pcb layout technique micro strip to cpwg material rogers 4003 with 1/2 oz. cu dielectric thickness 0.008 (0.20 mm) microstrip line width 0.018 (0.46 mm) cpwg line width 0.016 (0.41 mm) cpwg line to gnd gap 0.005 (0.13 mm) ground via hole diameter 0.008 (0.20 mm) c1 100 pf capacitor, 0402 pkg. c2 33,000 pf capacitor, 1206 pkg. hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 33 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com suggested lm1 pcb land pattern tolerance: 0.003 ( 0.08 mm) hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 34 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application circuit note: vgg1 should be applied to pin 6 to provide appropriate bias level to ampli er. voltage level should be adjusted until nominal idd of 220 ma is reached. recommended component values c1 100 pf c2 33,000 pf hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
8 amplifiers - smt 8 - 35 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com recommended smt attachment technique preparation & handling of the lm1 millimeterwave package for surface mounting the hmc lm1 package was designed to be compatible with high volume surface mount pcb assembly processes. the lm1 package requires a speci c mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. this pcb layout pattern can be found on each lm1 product data sheet. it can also be provided as an electronic drawing upon request from hittite sales & application engineering. follow these precautions to avoid permanent damage: cleanliness: observe proper handling procedures to ensure clean devices and pcbs. lm1 devices should remain in their original packaging until component placement to ensure no contamination or damage to rf, dc & ground contact areas. static sensitivity: follow esd precautions to protect against esd strikes. general handling: handle the lm1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. avoid damaging the rf, dc, & ground contacts on the package bottom. do not apply excess pressure to the top of the lid. solder materials & temperature pro le: follow the information contained in the application note. hand soldering is not recommended. conductive epoxy attachment is not recommended. solder paste solder paste should be selected based on the users experience and should be compatible with the metallization systems used. see the lm1 data sheet outline drawing for pin & ground contact metallization schemes. solder paste application solder paste is generally applied to the pcb using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical & electrical performance. excess solder may create unwanted electrical parasitics at high frequencies. solder re ow the soldering process is usually accomplished in a re ow oven but may also use a vapor phase process. a solder re ow pro le is suggested above. prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies. the thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. the nal pro le should be determined by mounting the thermocouple to the pcb at the location of the device. follow solder paste and oven vendors recommendations when developing a solder re ow pro le. a standard pro le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. allow enough time between reaching pre-heat temperature and re ow for the solvent in the paste to evapo- rate and the ux to completely activate. re ow must then occur prior to the ux being completely driven off. the duration of peak re ow temperature should not exceed 15 seconds. packages have been quali ed to withstand a peak temperature of 235c for 15 seconds. verify that the pro le will not expose device to temperatures in excess of 235c. cleaning a water-based ux wash may be used. recommended solder reflow profile for hmc lm1 smt package 25 50 75 100 125 150 175 200 225 012345678 temperature ( 0 c) time (min) hmc300lm1 smt medium power gaas mmic amplifier, 25.5 - 33.5 ghz v02.1201
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